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Silicone Thermal Conductive Gap Filler With High Thermal Conductive Up To 3W/m.K
Attribute | Value | Test Method |
---|---|---|
Composition | Ceramic filler + Silicone | - |
Color | Green | Visual |
Density(g/cc) | 2.9 | ASTM D792 |
Extrudability(g/s) | 5.0 | ISO9048 |
Usage Temperature(℃) | -40~150 | -- |
Electrical | ||
Breakdown Voltage(kv/mm) | ≥5.0 | ASTM D149 |
Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
Volume Resistivity(Ω.cm) | 1.0*1014 | ASTM D257 |
Flammability | V-0 | UL94 |
Thermal | ||
Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 1.0-6.0 W/m.K
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Purchasing information
Packing specification: 300ml Cartridge/ 1kg Jar/20kg Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.