Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Non-Vulcanized Silicone Oil And Thermally Conductive Filler Mixture Heat Sink Thermal Grease
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture | - |
| Color | White | Visual |
| Density(g/cc) | 2.8 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.0 | ASTM D5470 |
| Thermal Resistance(℃-in2/W)0.1mm@50psi) | 0.15 | ASTM D5470 |
Product feature
■ Thermal conductivity: 1.0~5.0W/m.K
■ No cure required
■ High reliability
■ Minimizes contact resistance
■ High volume applications
Typical applications
■ It is applicable to the contact surface between power amplifier tube and heat sink in the electronic industry, such as TV, DVD, CPU and power amplifier tube, playing the role of thermal media
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Product Reminder
Packing specification
Packing specification: 30ml/ 1Kg 2Kg 10Kg
Instructions
Clean the application surface first, then stir the silicone grease evenly, and then apply the silicone grease to the surface by dot coating, brushing or screen printing. If screen printing is used, it is recommended to use 60-80 mesh nylon screen, and a rubber scraper with a hardness of about 70. When coating, apply silicone grease at about 45 degrees to the coated surface. After the operation, unused products should be sealed and stored in time.
Shelf life & Storage:
Shelf life of the product is 6 months after date of shipment. Store in a cool, dry, well ventilated place.
Shenzhen Aochuan Technology was founed in 2004. We are committed to offer thermal design solutions with our leading technology of R&D, lean production and global sales network of thermal interface materials.
