Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

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Shenzhen Aochuan Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJason Zhan
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Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

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Brand Name :AOK
Model Number :TF300
Certification :RoHS, Reach, UL
Place of Origin :China
MOQ :400ml(200ml each part)
Payment Terms :T/T
Delivery Time :13-15 working days
Packaging Details :50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Composition :Ceramic filler + Silicone
Color :Light Blue
Density :3 g/cc
Breakdown Voltage :≥7.0 kv/mm
Usage Temperature :-40~150 ℃
Dielectric Constant :7.0(@10mhz)
Flammability :V-0
Thermal conductivity :3.0 W/m.K
Viscosity/Component A :400000 (cps)
Viscosity/Component B :400000 (cps)
Hardness, after cure :40 (shore oo)
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Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

Features & Benefits

1 High thermal conductivity, low thermal resistance, excellent wettability
2 Low pressure to electronic components
3 Manageable raw material stock ,lower composite cost
4 For vehicle electronic products
5 Can fill any uneven gaps
6 Automatic point dispensing available, any thickness or size available
7 High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.

Typical Applications

1 Communication equipment
2 Power equipment
3 Medical instrument
4 New energy vehicle
5 Filling any gap between friable component and shell

Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)

Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
C : 12-16 hours
• Full cure @ 100
C : 1 hour

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

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