Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

Manufacturer from China
Active Member
4 Years
Home / Products / Ultra Soft Thermal Pad /

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Contact Now
Shenzhen Aochuan Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJason Zhan
Contact Now

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Ask Latest Price
Video Channel
Brand Name :AOK
Model Number :UTP100
Certification :RoHS, Reach, UL
Place of Origin :China
MOQ :1000pcs
Payment Terms :T/T
Delivery Time :13-15working days
Packaging Details :400mmx200mm
Product name :Ultra Soft Thermal Pad High breakdown voltage with 1.0w thermal conductivity
Usage Temperature(℃) :-40~150
Breakdown Voltage(kv/mm) :≥7.0
Thickness :0.5~12.0 (mm)
Tensile Strength(KN/m) :2.5
Hardness :30±5(Shore OO)
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

Product feature:
■ Thermal Conductivity:1.0 W/m.K
thermal silicone sheet with shock absorption and sound absorption effect;
thermal silicone sheet has the convenience of installation, testing and reusable.
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
The thermal conductivity of the thermal silica gel sheet is adjustable and the thermal stability is better;

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Inquiry Cart 0