Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

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Shenzhen Aochuan Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJason Zhan
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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

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Brand Name :AOK
Model Number :UTP100
Certification :RoHS, Reach, UL
Place of Origin :China
MOQ :1000pcs
Payment Terms :T/T
Delivery Time :13-15working days
Packaging Details :400mmx200mm
Tensile Strength(KN/m) :2.5
Elongation(%) :60
Usage Temperature(℃) :-40~150
Product name :Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity
Density :2.5(g/cc)
Hardness :30±5(Shore OO)
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Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

Product feature:
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;

with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;

Typical applications:
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

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