Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

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Shenzhen Aochuan Technology Co., Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJason Zhan
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Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

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Brand Name :AOK
Model Number :TP800
Certification :RoHS, Reach, UL
Place of Origin :China
MOQ :1000 pcs
Payment Terms :T/T
Delivery Time :13-15 working days
Packaging Details :400 mm x 200 mm
Product Name :8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink
Composition :Ceramic Filler + Silicone
Color :Pink
Thickness :0.5~10 mm
Dielectric Constant :7.2(@10mhz)
Volume Resistivity :1.0*10^12(Ω.cm)
Thermal Conductivity :8.0 W/m.K
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8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

Product feature
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
The material is soft, with good compressibility, good thermal conductivity and insulation, and a large adjustable range of thickness. It is suitable for filling the cavity. Both sides have natural viscosity and strong operability and maintainability;
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

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